En

18

Jun
EMS, Industry Briefs, Supply Chain

18

Jun
Capabilities, Process Briefs, Supply Chain

PROCESSES

Through Hole Assembly

Electronics Manufacturing Services

Profab Electronics provides comprehensive through-hole assembly services that complement our surface mount capabilities. Our through-hole processes—including selective soldering, wave soldering, and precision hand assembly—deliver the mechanical strength and reliability that demanding applications require.

INTRODUCTION

Through-Hole Technology for Demanding Applications

Through-hole technology remains an essential element of electronics manufacturing despite the predominance of surface mount assembly in modern designs. While surface mount components offer density and efficiency advantages, through-hole components provide mechanical strength, power handling capability, and connection reliability that many applications require.

The PCB assembly expertise at Profab Electronics encompasses comprehensive through-hole capabilities addressing the full range of leaded component requirements. Our PCB smt process capabilities integrate seamlessly with our through-hole operations, enabling efficient production of mixed-technology assemblies with quality solder joints for both technology types.

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GUIDE

The Profab Through Hole Process Capabilities

Understanding through-hole assembly processes helps customers optimize their designs and specify appropriate manufacturing requirements. Our comprehensive guide covers critical topics including when through-hole technology is appropriate, design considerations for through-hole manufacturability, process selection for different assembly types, and workmanship standards and inspection criteria. This resource helps electronics companies achieve optimal through-hole assembly results.

We’re not just trying to predict the future, we’re trying to build it. Profab gives us the assurance we need to move faster with even more confidence”

— Josh Chaitowitz, SVP Operations

EXPERIENCE

Comprehensive Key Features of Through-Hole Assembly

Profab Electronics maintains through-hole assembly capabilities designed to address the full range of leaded component requirements. Our multiple process options enable selection of the optimal approach for each assembly’s specific characteristics and requirements.

Our through-hole processes have been developed to produce consistent, high-quality solder joints regardless of component type or board complexity. We recognize that through-hole assembly often represents critical interconnections—power connections, mechanical interfaces, high-reliability joints—and our processes reflect this criticality.

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Selective Soldering

Our selective soldering systems provide precise, automated soldering of through-hole components on mixed-technology boards. Programmable solder nozzles apply solder only to designated locations, protecting adjacent SMT components while creating consistent, high-quality through-hole joints.

Wave Soldering

Wave soldering efficiently processes boards with predominantly through-hole components, creating all joints in a single pass. Our wave soldering process is optimized for consistent hole fill and fillet formation while minimizing bridging and other defects.

Precision Hand Assembly

IPC-certified operators perform hand soldering for specialized requirements including odd-form components, connectors with specific handling needs, and low-volume production. Hand assembly capabilities ensure we can address any through-hole requirement regardless of automation suitability.

CUSTOMER STORY

Delivering Through-Assembly success to an Aerospace Industry Leader

Our selective soldering expertise and rigorous quality verification delivered assemblies that exceeded reliability requirements in demanding industrial applications.

ADVANTAGES

Through-Hole Excellence at Profab

Through-hole assembly quality directly affects product reliability for many applications. The connectors, power components, and mechanical interfaces often implemented with through-hole technology represent critical points where failure would render products inoperable. Profab Electronics’ through-hole capabilities deliver the joint quality and consistency that these critical applications demand. Our validated processes, trained operators, and systematic quality verification ensure that through-hole joints meet the elevated standards appropriate for their importance.

The flexibility of our through-hole capabilities provides advantages for customers with diverse product requirements. Our multiple process options enable selection of the most efficient approach for each assembly—selective soldering for mixed-technology boards, wave soldering for through-hole dominant designs, hand assembly for specialized or low-volume requirements. This flexibility ensures customers receive optimal manufacturing approaches regardless of their specific product characteristics, avoiding compromises that less capable manufacturers might require.

Process Flexibility

Multiple through-hole process options enable selection of the optimal approach for each assembly. Customers benefit from efficient manufacturing regardless of their specific technology mix or volume requirements.

Mixed-Technology Expertise

Our integrated SMT and through-hole capabilities efficiently produce mixed-technology assemblies. Process sequencing and selective soldering techniques protect SMT components while creating quality through-hole joints.

Certified Workmanship

Our through-hole operators maintain IPC certifications demonstrating competence in soldering workmanship. Certified personnel ensure consistent quality regardless of which specific individuals perform the work.

PROCESS

Through-Hole Assembly Process Flow

Through-hole assembly at Profab Electronics follows process flows appropriate for each assembly’s specific characteristics. The process approach is selected during front-end engineering based on component mix, board design, and production volume considerations.

Selective Soldering Process: For mixed-technology boards, through-hole components are typically installed after SMT assembly is complete. Components may be placed manually or using automated insertion equipment depending on volume and component types. The assembly then proceeds through selective soldering, where programmable solder nozzles apply flux and solder to each through-hole joint location individually. Process parameters including preheat temperature, solder contact time, and nozzle path are optimized for each assembly.

Wave Soldering Process: Boards with predominantly through-hole components may utilize wave soldering for efficient processing. Through-hole components are inserted, and the assembly passes through fluxing, preheating, and wave contact zones where molten solder creates all joints simultaneously. Process parameters are controlled to ensure proper hole fill and fillet formation while minimizing defects.

Hand Assembly Process: Components requiring manual installation and soldering are processed by IPC-certified operators using appropriate soldering equipment. Operators follow documented work instructions specifying component orientation, soldering parameters, and workmanship requirements. Hand assembly provides flexibility for odd-form components, low volumes, and specialized requirements.

Following through-hole soldering, assemblies undergo inspection to verify joint quality. Visual inspection and automated optical inspection examine joints for proper fill, fillet formation, and absence of defects. Assemblies meeting through-hole quality requirements proceed to subsequent operations.

QUALITY ASSURANCE

Profab Electronics' Commitment to Quality

Through-hole solder joint quality is critical for many applications, and Profab Electronics maintains quality systems that ensure consistent excellence in through-hole assembly. Our processes are validated to produce joints meeting IPC-A-610 workmanship standards, with inspection criteria appropriate for the class level specified by customers—typically Class 2 or Class 3 for the demanding applications we serve.

Our through-hole operators maintain IPC certifications that demonstrate competence in soldering workmanship. Regular training and recertification ensure skills remain current. Work instructions provide clear guidance for component handling, soldering parameters, and quality requirements. These elements combine to ensure consistent workmanship regardless of specific personnel assignments.

Quality verification following through-hole assembly confirms joints meet requirements before assemblies proceed. Inspection examines hole fill, fillet formation, and absence of defects including insufficient solder, cold joints, bridging, and solder balls. Assemblies not meeting requirements are reworked by certified operators until quality standards are achieved.

ISO 9001 Certified

ISO 9001

AS9100D Certified

AS 9100

Continuous Improvement

Integrated QMS

Certifications & Training

Conclusion

Profab Electronics’ through-hole assembly capabilities provide complete solutions for leaded component requirements. Whether your assemblies require selective soldering for mixed-technology boards, wave soldering for through-hole dominant designs, or precision hand assembly for specialized requirements, our capabilities and quality systems deliver consistent excellence. Our through-hole expertise complements our surface mount capabilities to provide comprehensive PCB assembly services for any technology mix.

RESOURCES

Latest Resources and Insights

Profab Electronics is a leading provider of contract manufacturing services for PCB assemblies in the aerospace industry. With years of experience and expertise in the field, our team of experts.

FAQ

Frequently Asked Questions

Profab Electronics provides comprehensive through-hole assembly services. Our team addresses common questions about our through-hole capabilities

What through-hole assembly processes does Profab offer?

We offer selective soldering for mixed-technology boards, wave soldering for through-hole dominant assemblies, and hand soldering for specialized requirements. Process selection is based on each assembly’s specific characteristics and requirements.

Yes, mixed-technology assembly is common in our production. Our process sequencing and selective soldering capabilities enable efficient production of assemblies combining both technologies with quality joints for each.

We follow IPC-A-610 workmanship standards, typically producing to Class 2 or Class 3 requirements as specified by customers. Our operators maintain IPC certifications demonstrating competence in these standards.

Yes, our hand assembly capabilities accommodate odd-form components that cannot be processed through automated equipment. IPC-certified operators follow documented procedures to install and solder these components correctly.

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